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                ESD防护芯片
                ESD防护芯片

                Product status

                Unidirectional/bidirectional

                Channel

                Top Metal

                Back Metal

                Die Size

                Die Size (Width/um)

                Wafer Saw(um)

                Thickness(um)

                Vrwm(V)

                Vbr(V@1mA)

                IR(uA)

                Cj(pf)

                Ipp(A)

                Vcc(V@Ippmax)

                ESD(kV)

                ??
                型号 pdf Unidirectional
                /bidirectional
                Channel Top Metal Back Metal Die Size (Length/um) Die Size (Width/um) Wafer Saw(um) Thickness(um) Vrwm(V) Vbr(V@1mA) IR(uA) Cj(pf) Ipp(A) Vcc(V@Ippmax) ESD(kV) 产品状态

                条数据